ESD Moisture Barrier Aluminum Foil Bag for IC Chips/Wafer/LED Packing
Foshan Shunde Topcod Industry Co., Ltd.- Shape：Seal Bag
- Material：Laminated Material
- Feature：Moisture Proof, Recyclable, Shock Resistance, Antistatic, Dustproof
- Application：Promotion, Household, Chemical, Industrial Use
- Making Process：Composite Packaging Bag
- Raw Materials：High Pressure Polyethylene Plastic Bag
Base Info
- Trademark：TOPCOD,OEM
- Specification：Customized
- Transport Package：Carton
- Peel Strength：>3.0n, 15mm
- Puncture Resistance：>100n
- Thickness：0.14mm, 0.2mm, etc
- Layers：Pet,Al,Ny,PE
- Printing：Blank or Customized
- Bag Variety：Upright Bag
- Model NO.：TP- packing bag
- Origin：China
- HS Code：3923290000
- Production Capacity：10000PCS,Day
Description
3-Specifications:
Horizontal >85N/ 15mm
Time: 0.6-4.5 seconds
Pressure: 30-70 PSI
1x105Ω< Inter surface<1x1011Ω
Metal layer<1x100Ω
4-Applications
Packaging of various PCB, IC, LED, hard disk, electronic parts and components, semiconductor,etc.
5-Company Display:
1: Established in 2001 with 18 years' experiences in this industry.
2: Combines R&D, production and sale together.
3: Owns advanced mechanized production line.
4: Product range: kinds of desiccants, humidity indicator card, Aluminum foil bag and other packing material.
6-Other hotselling products:
7-International Packaging Show
8-FAQ:Q1: Can I have samples first before placing orders?A1: Yes, we can offer you free samples and welcome your trial order.
Q2: When can I have the sample? How about the mass order?
A2: Usually the delivery of sample is 3-5 working days, and 15-20 days for the mass order.
Q3: Can you accept to print our own logo or brand on your products?
A3: Yes, customized style are welcomed here.
Q4:What is the packaging ?
A4:Carton packaging, the dimension is up to the product size.