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ESD Moisture Barrier Bag for Integrated Chip Packaging

Suzhou Sky Industrial Co., Ltd.
  • Material：Laminated Material
  • Shape：Open Top, Ziplock, Three Dimensional, Gusset
  • Feature：Moisture Proof, Shock Resistance, Antistatic, Light Isolation
  • Application：Food, Promotion, Household, Chemical, Apparel, Pricise Equipment, PC Board, IC, CD Driver
  • Making Process：Composite Packaging Bag
  • Raw Materials：Pet,Al,Ny,PE BOPP,Al,PE

Base Info

  • Transport Package：50 - 100PCS Per Bag, 5 - 50 Bags , Carton
  • Bag Type：Open Top, Zip Lock, Three Dimensional, Gusset
  • Surface Handling：Gravure Printing
  • Color：Silver
  • Industrial Use：Electronic Components, Semiconductive Industry
  • Function：Anti Static, Moisture Barrier, Light Isolation
  • Bag Variety：Open Top, Ziplock, Three Dimensional, Gusset
  • Model NO.：SZ-MB002
  • Specification：SGS ROHS report
  • Trademark：DIASAP
  • Origin：China Suzhou
  • HS Code：3923210000
  • Production Capacity：200000 PCS,Day

Description

Product DescriptionProduct NameESD Moisture Barrier Bag for Integrated Chip Packaging 
Material StructureLayers Laminated Material:
 
PET/AL/NY/PE  BOPP/AL/PE FeatureAnti-static, moisture barrier,light isolationPrintingCustomizedSurface Resistance10^6~10^11 OhmThicknessCustomized(0.06--0.2mm available)  Bag StyleOpen top/ zip lock/ envelope/ gusset/ three dimensionalPackage50~100pcs per bag and then in cartons or as per customer's requestUsageElectronic components (PCB, IC, HD driver),precise equipment
and chemical raw material etc. Technical Parameters:
NO.ItemStandardResult
1Puncture StrengthMIL-STD-3010B≥24LBF
2Surface resistivityASTM D-25710^6-10^11ohm
3Decay time IEC61340-5-1<0.3s
4WVTRASTM F1249≤0.0006g/100in²/24hs
5OTRASTM D3985≤0.01cc/100in²/24hs
6Heat-Seal Temperature 160%±10%
7Heat-Seal Pressure 70Pa
8Heat-Seal Time ≤1.5S
 Product Pictures: 



ESD Moisture Barrier Bag for Integrated Chip PackagingESD Moisture Barrier Bag for Integrated Chip PackagingESD Moisture Barrier Bag for Integrated Chip PackagingESD Moisture Barrier Bag for Integrated Chip PackagingESD Moisture Barrier Bag for Integrated Chip Packaging


Factory show:

ESD Moisture Barrier Bag for Integrated Chip Packaging 
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3.     Nylon Bag/Vacuum Bag
4.     Air Bubble Bag/making machine
5.    Industrial Cotton Swab Series 
6.    Humidity Indicator Card
7.    Cleanroom  Consumable Series
 

 

Free samples will be sent for your evaluation!