Metal Bonded Diamond Grinding Wheels
Suzhou Fukuda Package Material Co., Ltd.- Manufacturing Process：Sintered
- Shape：Flat-Shaped
- Bonding Agent：Metal
- Material：PCD
- Transport Package：Wood Carton
- Specification：Diameter 50mm-300mm
Base Info
- Model NO.：Diameter 50mm~300mm
- Trademark：HG
- Origin：China
- HS Code：6804221000
- Production Capacity：10000pieces,Year
Description
Basic Info.
Model NO. Diameter 50mm~300mm Trademark HG Origin China HS Code 6804221000 Production Capacity 10000pieces/YearProduct Description
Metal Bonded Diamond Grinding Wheels
1.Ceramic bond diamond grinding wheel
Appliable material: Semiconductor wafers and solar wafers, PCD (drill bits),CVD,PCBN,tungsten carbide,engineering structural ceramics,gem,crystal,magnetic material and other hard and brittle material.
2.Resin bond diamond grinding wheel
Appliable material :Non metallic materials,tungsten carbide, ceramic, agate, optical glass, semiconductor materials,cast iron,stone and so on.
3.Metal bond diamond grinding wheel
Appliable material:Glass,ceramic,silicon wafer,floor slab,marble,granite,concrete,semiconductor materials and super hard materials.
4.Features
Good for non metallic materials.
High efficiency and low consumption.
High accuracy.
Good thermal conductivity.
Good self-sharpening.
Less heat in grinding, fewer burned workpiece.
Predictable quality and shape for the workpiece.
